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Continue to ChatMorphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory - https://avesis.metu.edu.tr/yayin/1f8f0e93-d37c-400c-95a8-ce83564f2ce8/morphological-evolution-of-voids-by-surface-drift-diffusion-driven-by-capillary-electromigration-and-thermal-stress-gradients-induced-by-steady-state-heat-flow-in-passivated-metallic-thin-films-and-flip-chip-solder-joints-i-theory